Memory Test Socket

Model Number

BGA 0.8mm pitch I

Excellent Test Contact Solutions with high performance spring probes technology Price Advantage with wide selection of open tools

Device Applications

• DDR, DDR-II, DDR-III, SDRAM, GDDR, SRAM, GDDR
• 60 / 68 / 80 / 84 / 92 / 136 / 144 / 167 FBGA

Design Features

• Compatible design for currently available handlers
• Use various spring probe pins for contact
• Compact design for high density on PC Board
• Operation cycles over 100K times
• Both machining & molding available for housing
• Designed for tin flake and contact contamination
• Self-Cleaning by device contact
• Competitive development cost
• Designed for high frequency device
• Excellent design for Current flow & Cold test

Probe Pin : 1812-11HX

Mechanical Specifications

• Pin height : 3.10mm
• Contact force : 30g/ 0.55mm
• Full stroke : 0.62mm
• Target stroke : 0.55mm
• Operating temperature : -40~150C
• Life cycle : 300,000

Electrical Specifications

• Bandwidth : 16.40HZ@~0.5db
• Self inductance : 1.2nH
• Contact resistance : <50m ohm
• Current rating : 1.0A continuous
• Propagation delay : 14.406ps